The present invention relates to a method for manufacturing a circuit board assembly, which includes: mounting a plurality of components on a circuit board; preparing a mold comprising a concave portion corresponding to a shape of each of the plurality of components and a convex portion corresponding to a surface of the circuit board; providing the mold at an upper side of the circuit board and preparing a protective material to be disposed on the circuit board; disposing the protective material on the circuit board and the components by using the mold; and curing the protective material to form a protective layer.


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    Title :

    CIRCUIT BOARD ASSEMBLY MANUFACTURING METHOD, CIRCUIT BOARD ASSEMBLY MANUFACTURED BY SAME, AND ELECTRIC VEHICLE INCLUDING SAME


    Additional title:

    LEITERPLATTENANORDNUNGSHERSTELLUNGSVERFAHREN, DAMIT HERGESTELLTE LEITERPLATTENANORDNUNG UND ELEKTROFAHRZEUG DAMIT
    PROCÉDÉ DE FABRICATION D'ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ, ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ FABRIQUÉ PAR CELUI-CI, ET VÉHICULE ÉLECTRIQUE LE COMPRENANT


    Contributors:
    LEE BUM JICK (author) / SON YOUNG SU (author)

    Publication date :

    2024-01-17


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen