The present invention relates to a method for manufacturing a circuit board assembly, which includes: mounting a plurality of components on a circuit board; preparing a mold comprising a concave portion corresponding to a shape of each of the plurality of components and a convex portion corresponding to a surface of the circuit board; providing the mold at an upper side of the circuit board and preparing a protective material to be disposed on the circuit board; disposing the protective material on the circuit board and the components by using the mold; and curing the protective material to form a protective layer.
CIRCUIT BOARD ASSEMBLY MANUFACTURING METHOD, CIRCUIT BOARD ASSEMBLY MANUFACTURED BY SAME, AND ELECTRIC VEHICLE INCLUDING SAME
LEITERPLATTENANORDNUNGSHERSTELLUNGSVERFAHREN, DAMIT HERGESTELLTE LEITERPLATTENANORDNUNG UND ELEKTROFAHRZEUG DAMIT
PROCÉDÉ DE FABRICATION D'ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ, ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ FABRIQUÉ PAR CELUI-CI, ET VÉHICULE ÉLECTRIQUE LE COMPRENANT
17.01.2024
Patent
Elektronische Ressource
Englisch
Europäisches Patentamt | 2021
|Europäisches Patentamt | 2023
|Europäisches Patentamt | 2022
|Europäisches Patentamt | 2025
Europäisches Patentamt | 2021
|