The invention provides a method for manufacturing a circuit board assembly. The method comprises the following steps: mounting a plurality of components on a circuit board; preparing a mold including concave portions corresponding to shapes of the plurality of components and convex portions corresponding to a surface of the circuit board; preparing a mold above the circuit board, and preparing a protective material to be placed on the circuit board; placing a protective material on the circuit board and the component by using a mold; and curing the protective material to form a protective layer.

    本发明提供了电路板组件制造方法,所述方法包括以下步骤:将多个部件安装在电路板上;准备模具,所述模具包括与多个部件的形状相对应的凹部和与电路板的表面相对应的凸部;在电路板的上方准备模具,并且准备要置于电路板上的保护材料;通过使用模具将保护材料置于电路板和部件上;以及固化保护材料以形成保护层。


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    Titel :

    Circuit board assembly manufacturing method, circuit board assembly manufactured by method, and electric vehicle including assembly


    Weitere Titelangaben:

    电路板组件制造方法、通过该方法制造的电路板组件和包括该组件的电动车辆


    Beteiligte:
    LEE BUM JICK (Autor:in) / SON YOUNG-SU (Autor:in)

    Erscheinungsdatum :

    20.09.2022


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Chinesisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen